JPH0544761B2 - - Google Patents

Info

Publication number
JPH0544761B2
JPH0544761B2 JP60145741A JP14574185A JPH0544761B2 JP H0544761 B2 JPH0544761 B2 JP H0544761B2 JP 60145741 A JP60145741 A JP 60145741A JP 14574185 A JP14574185 A JP 14574185A JP H0544761 B2 JPH0544761 B2 JP H0544761B2
Authority
JP
Japan
Prior art keywords
light emitting
socket
lead frame
emitting diodes
lamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP60145741A
Other languages
English (en)
Japanese (ja)
Other versions
JPS628403A (ja
Inventor
Hiroyuki Serizawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koito Manufacturing Co Ltd
Original Assignee
Koito Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koito Manufacturing Co Ltd filed Critical Koito Manufacturing Co Ltd
Priority to JP60145741A priority Critical patent/JPS628403A/ja
Publication of JPS628403A publication Critical patent/JPS628403A/ja
Publication of JPH0544761B2 publication Critical patent/JPH0544761B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Securing Globes, Refractors, Reflectors Or The Like (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
JP60145741A 1985-07-04 1985-07-04 車輛用灯具 Granted JPS628403A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP60145741A JPS628403A (ja) 1985-07-04 1985-07-04 車輛用灯具

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60145741A JPS628403A (ja) 1985-07-04 1985-07-04 車輛用灯具

Publications (2)

Publication Number Publication Date
JPS628403A JPS628403A (ja) 1987-01-16
JPH0544761B2 true JPH0544761B2 (en]) 1993-07-07

Family

ID=15392072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60145741A Granted JPS628403A (ja) 1985-07-04 1985-07-04 車輛用灯具

Country Status (1)

Country Link
JP (1) JPS628403A (en])

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0525124Y2 (en]) * 1989-12-20 1993-06-25
DE602004028099D1 (de) 2003-02-07 2010-08-26 Panasonic Corp Beleuchtungseinrichtung, einen sockel verwendend, um ein flaches led-modul auf einen kühlkörper zu montieren
JP2005114924A (ja) * 2003-10-06 2005-04-28 Pentax Corp 撮影用照明装置
US20090168126A1 (en) * 2006-02-22 2009-07-02 Nippon Sheet Glass Co., Ltd. Light Emitting Unit, Lighting Apparatus and Image Reading Apparatus

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6092852U (ja) * 1983-11-30 1985-06-25 白光電器工業株式会社 灯器の発光部分

Also Published As

Publication number Publication date
JPS628403A (ja) 1987-01-16

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